Proceedings of the IEEE

2024 Journal Issues

December 2024

Regular Papers Volume 112, Issue 12 December 2024 Access the Full Issue Regular Papers Scanning the Issue Digital Phenotyping and Feature Extraction on Smartphone Data for Depression Detection By M. Yang et al. This article provides a comparative overview of relevant studies on…

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Celebrating National Robotics Week (April 5-12)

April 11, 2025

In recognition of National Robotics Week (April 5-12), we've curated a selection of robotics-focused articles and special issues from Proceedings of the IEEE, ranging from explorations of robotics in 1983 to advancements in surgical robotics in 2022. This collection offers a glimpse…

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3D and 4D Printing: The Future of Additive Manufacturing

March 25, 2025

Multi-material 3D/4D printing is unlocking new dimensions in electronics design and production The field of additive manufacturing is evolving, moving from research and development to real-world applications in sectors like aerospace, medical devices, and next-generation electronics. In a recent Design News…

Webinar Series

Webinar on Next-Generation Multiple Access (April 28, 2025, 1-2 PM ET)

March 20, 2025

28 April 2025, 1 - 2 PM ET Register Now | View Special Section Description Multiple access is a fundamental technology in wireless networks, allowing numerous user terminals to connect simultaneously within available radio resources. As next-generation wireless networks evolve, they must meet…

The Evolution of Applications, Hardware Design, and Channel Modeling for Terahertz (THz) Band Communications and Sensing: Ready for 6G?

March 13, 2025

Title The Evolution of Applications, Hardware Design, and Channel Modeling for Terahertz (THz) Band Communications and Sensing: Ready for 6G? Authors J. M. Jornet et al. Abstract For decades, the terahertz (THz) frequency band had been primarily explored in the context…

In-Band Full-Duplex: The Physical Layer

March 13, 2025

PUBLISHED IN MAY 2024 Title In-Band Full-Duplex: The Physical Layer Authors B. Smida, R. Wichman, K. E. Kolodziej, H. A. Suraweera, T. Riihonen and A. Sabharwal Abstract In this article, we review the key concepts and the progress in the design of…

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Training Spiking Neural Networks Using Lessons From Deep Learning

February 27, 2025

PUBLISHED IN September 2023 Article Title Training Spiking Neural Networks Using Lessons From Deep Learning Presenter Jason K. Eshraghian (University of California at Santa Cruz) View this article on IEEE Xplore

Webinar Series

2024 Best Paper Webinar

February 24, 2025

24 February 2025, 4 - 5 PM ET Read the 2024 Best Paper | View Webinar Recording 2024 Best Paper Winner "Training Spiking Neural Networks Using Lessons From Deep Learning" by Jason K. Eshraghian, Max Ward, Emre O. Neftci, Xinxin Wang, Gregor Lenz, Girish Dwivedi,…

2024 Journal Issues

November 2024

February 5, 2025

Regular Papers Volume 112, Issue 11 November 2024 Access the Full Issue Regular Papers Scanning the Issue Semantic Communication: A Survey on Research Landscape, Challenges, and Future Directions By T. M. Getu, G. Kaddoum, and M. Bennis This survey provides a comprehensive treatment…

2024 Journal Issues

October 2024

January 1, 2025

Regular Papers Volume 112, Issue 10 October 2024 Access the Full Issue Regular Papers Scanning the Issue Domain Generalization for Medical Image Analysis: A Review By J. S. Yoon, K. Oh, Y. Shin, M. A. Mazurowski, and H.-I. Suk This review categorizes domain…

Author page: jsun

December 2024

Celebrating National Robotics Week (April 5-12)

3D and 4D Printing: The Future of Additive Manufacturing

Webinar on Next-Generation Multiple Access (April 28, 2025, 1-2 PM ET)

The Evolution of Applications, Hardware Design, and Channel Modeling for Terahertz (THz) Band Communications and Sensing: Ready for 6G?

In-Band Full-Duplex: The Physical Layer

Training Spiking Neural Networks Using Lessons From Deep Learning

2024 Best Paper Webinar

November 2024

October 2024

Webinar on Next-Generation Multiple Access (April 28, 2025, 1-2 PM ET)

2024 Best Paper Webinar

Webinar on Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing

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