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proceedings of the ieee cover aug 2024
proceedings of the ieee cover aug 2024

Special Section: Additively Manufactured Electronic Components in Multimaterial 3-D and 4-D Printing

Volume 112, Issue 8

August 2024

Guest Editors

Special Section Papers

By Y. Yang and M. M. Tentzeris

By Y. Yang et al.

This article presents a comprehensive review of the emerging 3-D/4-D printing and origami techniques using multimaterial (conductive and dielectric materials) and shape-memory materials for designing functional electronic components and devices.

By E. Park et al.

This article reviews the latest reconfigurable metasurface studies using 3-D/4-D printing technology

By G.-B. Wu et al.

This article presents a comprehensive study encompassing the latest developments in 3-D printing technologies for terahertz antenna fabrication and design and highlights future materials and printing technology that can be used to create sophisticated terahertz antennas and systems.

By H. Aubert, D. Henry, and P. Pons

This article focuses on the 3-D-printed microwave and millimeter-wave components integrating Gallium-based liquid metal.

By V. Palazzi et al.

This article describes sensors and radio-frequency (RF) components fabricated by using emerging additive manufacturing technologies (3-D printing, metal foil tape, liquid metal filling, electro and electroless plating, and surface embossing).

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