Terahertz RF Electronics and System Integration
Volume 105, Issue 6 | June 2017
Guest Editors:
Special Issue Papers
Scanning the Issue: Terahertz RF Electronics and System Integration
By T. W. Crowe, W. R. Deal, M. Schröter, C.-K. C. Tzuang, and K. Wu
THz Diode Technology: Status, Prospects, and Applications
By I. Mehdi, J. V. Siles, C. Lee, and E. Schlecht
This paper describes the current status of GaAs Schottky diode technology including operation, performance, and application to mixers and multipliers.
Status and Prospects of High-Power Heterostructure Barrier Varactor Frequency Multipliers
By J. Stake, A. Malko, T. Bryllert, and J. Vukusic
The paper provides an overview of the heterostructure barrier varactor (HBV) and its application to frequency multipliers.
Advanced Terahertz Sensing and Imaging Systems Based on Integrated III-V Interband Tunneling Devices
By L. Liu, S. M. Rahman, Z. Jiang, W. Li, and P. Fay
This paper describes a novel diode for detector applications at submillimeter-wave frequencies.
Si/SiGe:C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications
By P. Chevalier, M. Schröter, C. R. Bolognesi, V. d’Alessandro, M. Alexandrova, J. Böck, R. Flückiger, S. Fregonese, B. Heinemann, C. Jungemann, R. Lövblom, C. Maneux, O. Ostinelli, A. Pawlak, N. Rinaldi, H. Rücker, G. Wedel, and T. Zimmer
This paper describes Si/SiGe:C and InP/GaAsSb heterojunction bipolar transistors (HBTs), and provides information on thermal and substrate effects, reliability, and radio-frequency (RF) performance.
InP HBT Technologies for THz Integrated Circuits
By M. Urteaga, Z. Griffith, M. Seo, J. Hacker, and M. J. W. Rodwell
This paper describes the operation and scaling of InP heterojunction bipolar transistors (HBTs) to terahertz frequencies.
SiGe HBT Technology: Future Trends and TCAD-Based Roadmap
By M. Schröter, T. Rosenbaum, P. Chevalier, B. Heinemann, S. P. Voinigescu, E. Preisler, J. Böck, and A. Mukherjee
This paper presents a technology roadmap for the electrical performance of high-speed silicon–germanium (SiGe) heterojunction bipolar transistors (HBTs).
Silicon Millimeter-Wave, Terahertz, and High-Speed Fiber-Optic Device and Benchmark Circuit Scaling Through the 2030 ITRS Horizon
S. P. Voinigescu, S. Shopov, J. Bateman, H. Farooq, J. Hoffman, and K. Vasilakopoulos
This paper reviews the technology requirements of future 100–300-GHz millimeter-wave systems-on-chip for various applications.
Silicon-on-Insulator Substrates as a Micromachining Platform for Advanced Terahertz Circuits
By N. S. Barker, M. Bauwens, A. Lichtenberger, and R. Weikle, II
This paper considers the development of terahertz systems-on-chip using micromachining techniques based on silicon-on-insulator technology.
Packages for Terahertz Electronics
By H.-J. Song
This paper provides an overview of recent progress in interconnections and packaging technologies for the practical use of terahertz electronic devices and integrated circuits.
Micromachined Packaging for Terahertz Systems
By G. Chattopadhyay, T. Reck, C. Lee, and C. Jung-Kubiak
This paper highlights key developments in the use of micromachining techniques for the packaging of terahertz frequency systems.
Metrology State-of-the-Art and Challenges in Broadband Phase-Sensitive Terahertz Measurements
By M. Naftaly, R. G. Clarke, D. A. Humphreys, and N. M. Ridler
The paper reviews the state of the art and challenges of terahertz metrology in both free-space and waveguide-based instrumentation. In particular, it discusses the instrumental and methodological disconnect between the two platforms, and the barriers to establishing interoperability.
Terahertz Reflecting and Transmitting Metasurfaces
By S.-W. Qu, H. Yi, B. J. Chen, K. B. Ng, and C. H. Chan
This paper reviews developments in wave manipulation from microwave to optical frequencies, together with new results in the terahertz regime.
Point of View
Safety and Security of Cyber-Physical and Internet of Things Systems
By Marilyn Wolf and Dimitrios Serpanos
Scanning Our Past
Hamming Window to the Digital World
By Zoran S. Bojkovic, Bojan M. Bakmaz, and Miodrag R. Bakmaz
